PostDoctoral Associate
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Job Summary
The Department of Electrical, Computer and Energy Engineering (ECEE) at CU Boulder is seeking a highly qualified engineer to work with a small, elite team, and also independently, developing exotic new thin film technologies. Because of the innovative nature of the work, the engineer will need to use a wide array of semiconductor processing skills. The device development will require insights and creativity. Much of the work will initially be carried out at nanofabrication user facilities associated with universities, and will require the engineer to be stationed at the location for several weeks at a time, or more. The small team works closely together in an enthusiastic and mutually supportive culture.
Who We Are
ECEE at CU Boulder is an outstanding undergraduate and graduate program in Colorado by reputation, rankings and size! We are also:
- Part of one of the top-ranked engineering schools in the nation.
- Our undergraduate electrical engineering program was ranked No. 19 among our public peers in U.S. News and World Report's Best Engineering Programs for 2022.
- We are ranked No. 13 among public computer engineering programs and No. 20 among public electrical engineering programs in U.S. News and World Report's Best Graduate Schools for 2022.
What Your Key Responsibilities Will Be
Be a part of a team developing exotic new thin film technologies (please see required skills below).
What We Can Offer
The salary range for this position is $60,000 - $100,000 annually.
Benefits
Be Statements
What We Require
- PhD in electrical or chemical engineering, or similar a similar field.
- 3+ years of experience as a process engineer in an R&D environment.
- Extensive hands-on experience with photolithography tools, including contact mask aligners, spin coaters, etc.
- Extensive experience with metal deposition including, sputtering, electron beam evaporation.
- Extensive experience with dielectric deposition including sputtering, PECVD, and controlled oxidation.
- Working experience in processes used for wet etching, RIE/ICP etching, metal lift-off patterning, etc.
- Experience with process monitoring instrumentation such as SEM, profilometry, ellipsometry, reflectometry, etc.
What You Will Need
- Excellent problem-solving and analytical skills with the ability to use prior experience to make on-the-fly decisions about processes.
- Ability to manage multiple projects simultaneously.
- Ability to travel as needed, and work on site for extended periods.
- Skills to develop new processes as needed.
- Ability to monitor the processes using tools such as SEM, profilometry, and ellipsometry.
- Ability to develop and modify the recipes as needed to improve the process.
What We Would Like You to Have
- 5+ years of semiconductor processing experience.
- Back-end processing such as wafer dicing, wire bonding, etc.
- Experience with mask design using CAD systems.
- Experience with atomic layer deposition.
- Experience with stepper lithography.
Special Instructions
- Resume/CV
- Cover Letter
- (Optional) Transcripts/Proof of Degree: If you are selected as the finalist, your degree will be verified by the CU Boulder Campus Human Resources Department using an approved online vendor. However, if your degree was obtained outside of the United States, please submit an English-translated version as an Optional document.
For full consideration, please apply by June 30, 2024. This position will remain open until filled.
Note: Application materials will not be accepted via email. For consideration, please apply through CU Boulder Jobs.
Posting Contact Information
Posting Contact Name: Boulder Campus Human Resources
Posting Contact Email: Recruiting@colorado.edu